UIC present at Apex Expo JAnuary 22-27, 2022

Universal Features Flexible Automation and Factory Software Solutions

at IPC APEX EXPO 2022

Join Universal Instruments on Booth #2233 at the IPC APEX EXPO in San Diego, CA on January 25–27. At the show, Universal will highlight its flexible automation solutions, Advanced Process Lab expertise and IQ360™ Factory Software Suite – designed to drive continuous improvement through machine-to-machine connectivity and dynamic closed-loop process control.

Universal delivers cost-effective, flexible solutions for virtually any automation challenge by leveraging versatile platforms and years of automation experience.

>FuzionOF™ is the fastest and most versatile high-speed automation platform

Uflex™ is the ultimate flexible assembly cell for odd-form insertion and mechanical assembly operations

The industry’s broadest knowledge base with 30+ years of experience implementing automation solutions across multiple markets

Universal’s IQ360 Factory Software Suite provides all of the tools needed to enhance operational efficiency. IQ360 is a suite of a la carte smart factory modules designed to control, monitor and improve all aspects of factory operations for maximum productivity:

Design & NPI Module: Achieve a production-ready first-pass yield

Material Management Module: Achieve higher efficiency and yields

Production Control Module: Optimize workflow and streamline production

Monitoring & Analytics Module: Leverage real-time data to maximize productivity

Universal’s Advanced Process Lab (APL) offers comprehensive research, analytical and advanced assembly services which enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.

Advanced Technology Assembly Services: Process development & optimization; Product development & assembly; Bring quality products to market faster.

Analytical Services: Failure analysis; Reliability/ quality testing; Identify and decisively address production and field failures.

AREA Consortium: Joint process & materials research with industry leaders; Help define the future of electronics assembly.