• High Performance
  • 3D Solder Paste Inspection
    with Quality Uplink
  • Extremely high throughput
  • due to FastFlow Handling
  • High reproducibility
  • Very efficient and easy operation
  • Fast program generation
  • Viscom Quality Uplink:
  • simple verification and
  • process optimization
  • Less scrap—
  • higher first pass yield
  • Combined high speed/
  • high resolution mode
  • Add-on modules: verification,
  • offline programming and
  • SPC evaluation